Power Semiconductors

TO268

TO268
Lead Count2L
Pad Size11.43 x 8.33 mm
Leadframe MaterialC194
Die AttachSoft solder
Wirebond5 - 15 mils Al
Body Size13.89 x 16.00 x 50.29 mm
Mold CompoundGR360 (Green), MG15F-35A
MarkingLaser
Lead Finish100Sn
PackagingTape and Reel, Tube/Bulk
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