Power Semiconductors

SOT89

SOT89
Lead Count3L
Pad Size2.03 x 1.98 mm
Leadframe MaterialC194 , C19210
Die AttachEpoxy
Wirebond1.0 - 2.0 mils Au
Body Size4.50 x 2.445 x 1.50 mm
Mold CompoundGR640A (Green)
MarkingLaser
Lead Finish100Sn
PackagingTape and Reel, Tube/Bulk
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