Power Semiconductors

SOT23

SOT23
Lead Count3L
Pad Size1.73 x 1.04 mm
Leadframe MaterialCDA194
Die AttachEpoxy
Wirebond1.0 - 1.3 mils Au
Body Size2.95 x 1.35 x 0.97mm
Mold CompoundEME-G600 (Green)
MarkingLaser
Lead Finish100Sn
PackagingTape and Reel, Bulk
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