Power Semiconductors

SOT223

SOT223
Lead Count4L
Pad Size2.30 x 2.34 mm
Leadframe MaterialA194
Die AttachEpoxy
Wirebond1.0 - 2.0 mils Au
Body Size6.50 x 3.50 x1.60 mm
Mold CompoundGR640A (Green)
MarkingLaser
Lead Finish100Sn
PackagingTape and Reel, Tube/Bulk
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