Power Semiconductors

SOIC

SOIC
Lead Count8L, 16L
Pad Size8L: 2.41 x 3.30mm, 16L: 2.286 x 3.30 mm
Leadframe MaterialC194
Die AttachEpoxy
Wirebond1.0 - 2.0 mils Au
Body Size3.90 x 4.90 x 1.49 mm, 3.9 x 9.9 x 1.49 mm
Mold CompoundGR640A (Green)
MarkingLaser, Ink
Lead Finish100Sn
PackagingTube
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