Power Semiconductors

SIP

SIP
Lead Count8L
Pad Size2.286 x 3.251 mm
Leadframe MaterialC151 3/4H
Die AttachEpoxy
Wirebond1.0 - 2.0 mils Au
Body Size3.90 x 9.90 x 1.45 mm
Mold CompoundEME-G600C (Green)
MarkingLaser, Ink
Lead Finish100Sn
PackagingTube, Tape and Reel
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