Power Semiconductors

SOT227 - LF1, LF2, LF3, LF4, LF5, LF6, LF7, LF8

SOT227 - LF1, LF2, LF3, LF4, LF5, LF6, LF7, LF8
Lead Count4L STD
Pad Size18.542 x 15.24 mm
Leadframe MaterialC10200 FH
Die AttachSoft solder
Wirebond5 - 20 mils Al
Body Size31.69 x 25.28 x 9.53 mm
Mold CompoundMG15F-0140
MarkingLaser
Lead FinishN/A
PackagingTube/Bulk
Lead Count4L PARALLEL, 4L ANTI-PARALLEL
Pad Size12.70 x 8.89 mm, 12.70 x 8.89 mm
Leadframe MaterialC10200 FH
Die AttachSoft solder
Wirebond5 - 20 mils Al
Body Size31.69 x 25.28 x 9.53 mm
Mold CompoundMG15F-0140
MarkingLaser
Lead FinishN/A
PackagingTube/Bulk
Lead Count4L BOOST
Pad Size18.524 x 11.176 mm, 8.636 x 3.81 mm
Leadframe MaterialC10200 FH
Die AttachSoft solder
Wirebond5 - 20 mils Al
Body Size31.69 x 25.28 x 9.53 mm
Mold CompoundMG15F-0140
MarkingLaser
Lead FinishN/A
PackagingTube/Bulk
Lead Count4L BUCK
Pad Size18.524 x 11.176 mm, 18.542 x 3.81 mm
Leadframe MaterialC10200 FH
Die AttachSoft solder
Wirebond5 - 20 mils Al
Body Size31.69 x 25.28 x 9.53 mm
Mold CompoundMG15F-0140
MarkingLaser
Lead FinishN/A
PackagingTube/Bulk
Lead Count4L
Pad SizeCustom DBC
Leadframe MaterialC10200 FH
Die AttachSoft solder
Wirebond5 - 20 mils Al
Body Size31.69 x 25.28 x 9.53 mm
Mold CompoundMG15F-0140
MarkingLaser
Lead FinishN/A
PackagingTube/Bulk
Lead Count4L STD
Pad Size17.78 x 12.70 mm
Leadframe MaterialC10200 FH
Die AttachSoft solder
Wirebond5 - 20 mils Al
Body Size31.69 x 25.28 x 9.53 mm
Mold CompoundMG15F-0140
MarkingLaser
Lead FinishN/A
PackagingTube/Bulk
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