Products & Services

RF and Microwave - Signal Conditioning / Control

switches


Switches

   Capabilities
- Assembly
- Test/Tune

Major Assembly Processes
- Manual Soldering
- Component Mounting
- Eutectic Die Attach
  (AuSi/AuSn Preforms)
- Epoxy Die Attach
  (Hand Mount)
-  Wire Bonding
   * Manual Wedge to Wedge using Au wire
   * Manual Ball to Wedge
   * Auto Wire Bonder
- Plasma Cleaning
- X-Ray
  * Die Attached/encapsulant void monitor
  * Wire bond loop height and short monitor		 Test Parameters
- Insertion Loss
- Isolation Loss
- Input Band of Interest
- Signal Level (Power Out)
- Open/Short
- Voltage Breakdown

amplifiers


Amplifiers

   Capabilities
- Assembly
- Test/Tune

Major Assembly Processes
- Manual Soldering
- Component Mounting
- Solder Feed-Thru Mounting
- Eutectic Die Attach
  (AuSi/AuSn Preforms)
- Epoxy Die Attach
  (Hand Mount)
-  Wire Bonding
   * Manual Wedge to Wedge using Au wire
   * Manual Ball to Wedge
   * Auto Wire Bonder
- Open Face Leak Test
   (He Fine Leak Test up to 10-8 atm-cc/sec)
- Plasma Cleaning
- X-Ray
  * Die Attached/encapsulant void monitor
  * Wire bond loop height and short monitor		 Test Parameters
- Insertion Loss
- Isolation Loss
- VSWR/ Return Loss
- 1dB Compression
- Noise Figure
- Intercept Points (IP)
limiters

Limiters		   Capabilities
- Assembly
- Test/Tune

Major Assembly Processes
- Manual Soldering
- Component Mounting
- Eutectic Die Attach
  (AuSi/AsSn Preforms)
- Epoxy Die Attach
  (Hand Mount)
-  Wire Bonding
   * Manual Wedge to Wedge using Au wire
   * Manual Ball to Wedge
   * Auto Wire Bonder
- Plasma Cleaning
- X-Ray
  * Die Attached/encapsulant void monitor
  * Wire bond loop height and short monitor		 Test Parameters
- Open/Short
- Break Voltage
mixer

Mixers		   Capabilities
- Assembly
- Test/Tune

Major Assembly Processes
- Manual Soldering
- Component Mounting
- Wire Twisting
- Core Winding
- Gap Welding
- Sealing
  * Seam Welding
  * Projection Welding
  * Epoxy Sealing
- Gross/Fine Leaks
  * He Fine Leak Testing
  * Bubble Gross Leak Testing
- Marking
  * Ink Marking
  * Engraving
- Tape and Reel
  (Hot and Cold Run Capable)		 Test Parameters
- Conversion Loss
- Isolation Loss

synthesizers

Synthesizer

   Capabilities
- SMT
- Assembly
- Test/Tune

Major Assembly Processes
- SMT
- Manual Soldering
- Component Mounting
- Burn-In
- Temperature Cycling
  (Mil-Std-883 TM1010 Condition A/C		 Test Parameters
- Short Circuit Test
- Voltage Regulation Test
- Functional Test
- Synthesis Check
- Tuning Voltage Band Limits
- Loop Bandwidth
- Harmonics