Products & Services

Semicon - Other Services

Wafer Backgrind

- 5 inch up to 8 inch wafer diameter grinding down to 7-mil final wafer thickness

 
Wafer Probe

- up to 6 inch diameter capability

- parallel testing

 
Wafer Sort

- up to 6 inch diameter capability

- 2-bin capability film frame output

 
Wafer Saw

- single/double mesa construction

- standard cut square/special cut hexagonal

- flip frame output

 
Wafer Plate

- 10x to 100x inspection capability

- waffle/vial pack