RF and Microwave - Module Assembly Packages

SURFACE MOUNT TECHNOLOGY

Capabilities - Pick and Place - Screen Printing - Reflow Sodlering (Pb and Pb-Free Reflow Ovens) - Manual Soldering - PTH Solderng - X-Ray (Solder Void Monitor)

CHIP-ON-BOARD

Capabilities - Manual Soldering - Component Mounting - Solder Feed-Thru Mounting - Eutectic Die Attach (AuSi/AuSn Preforms) - Epoxy Die Attach (Hand Mount) - Wire Bonding - Open Face Leak Test (He Fine Leak Test up to 10-8  atm-cc/sec) - Plasma Cleaning - X-Ray - Epoxy/Glop Top Encapsulation