| ,, |
Semicon Fastech offers semiconductor packages such as
TOs, SOTs, DPAKs, IPAKs, LCCs, PDIPs, PLCCs, metal cans,
and clear packages. It also has the capability to do
printed circuit board assembly, module assembly and
complete product assembly. The
Company can work with a customer to customize various
product requirements. It has a strong product
development and Engineering team that is focused on
offering better solutions to customer needs.
Core Competence:
Packaging &
Tests
-
Power Discretes
(Pbfree/Green Compound)
-
Micro Packages
(Pbfree/Green Compound)
-
SOIC/PDIP
Packages
-
Opto Clear Packages
SO/DIP/SIP
-
Metal Can -
Opto/Power
RF and Microwave Fastech is a world class provider of 23 manufacturing services
for leading RF and microwave companies.
With more than 10 years of experience in
RF and microwave assemblies, we offer a
complete range of manufacturing capabilities including
the full spectrum of RF and microwave testing and tuning.
RF and Microwave Components and Module
Assembly/ Test/ Tuning
-
Low Noise Amplifiers (LNA)
-
Power Dividers
-
RF Mixers
-
VCO, OCXO, VTDRO, PDRO
-
Ferrite Isolators and Circulators
-
PCB, HTCC, Thin Film Hybrid, SMT Assembly
Manufacturing
Arrangements
-
Standard Contract
Manufacturing
-
Captive Line
Manufacturing
-
Dedicated/Semi-Captive
Line
-
Shelter
Management
-
Joint
Venture
 |
Availability
|
|
| TO |
Transistor
Outline |
| IPAK |
Transistor
Outline (TO-251)
|
| DPAK |
Transistor
Outline (TO-252)
|
| DDPAK |
Transistor
Outline (TO-263)
|
|
|
| |
| Package |
Lead Count |
| |
|
|
| TO92 |
2L/3L |
| IPAK |
3L/5L |
| DPAK |
2L/3L/5L |
| DDPAK |
2L/3L/5L |
| TO220 |
3L/5L |
| TO220 B/C |
3L |
| TO202 VI/V3 |
3L |
|
| |
 |
Availability
|
|
| SOT |
Small Outline
Transistor |
| TSOT |
Thin Small Outline
Transistor |
|
|
| |
| Package |
Lead
Count |
| |
|
|
| SOT23 |
3L/5L/6L |
| TSOT23 |
5L |
| SOT89 |
3L |
| SOT223 |
3L |
|
| |
 |
| Package
Offering: |
|
| SOIC |
Small Outline Integrated
Circuit |
| SIP |
Single In-line
Package |
| |
| Package |
Lead
Count |
| |
|
|
| SOIC(150
mils) |
8L/14L/16L/18L |
| SIP |
2L/5L/8L |
|
|
| Packaging
Options |
|
|
|
| Clear Package |
|
| Black Package |
|
|
| |
|
Leadless Chip
Carrier
Packages |
 |
| Package
Offering: |
|
| LCC |
Leadless Chip
Carrier |
| |
| Package |
Lead
Count |
| |
|
LCC |
8L/10L |
|
| |
 |
| Package
Offering: |
|
| TO |
Transistor Outline - Metal
Cans |
| |
| Package |
Lead
Count |
| |
| TO-5 |
2L - 10L |
| TO-18 |
2L - 10L |
| TO-45 |
2L - 10L |
| TO-56 |
2L - 10L |
| TO-71 |
2L - 10L |
| TO-72 |
2L - 10L |
|
|
|
|
| |
| RF &
Microwave Components and Modules
|
RF & Microwave
(click for more info )
|
|
Capability
RF Mixer Assembly/ Test/ Tune
Amplifier Assembly/ Test /Tuning
Technology
Full Complete Assembly
Die attach
Ribbon bonding
Gap Welding
Micro soldering
Encapsulation
Seam Welding
Harmonics Test to 8 GHz
|
|
 ..
|
|
Package
Assembly Offering:
|
|
|
Capability |
|
| Surface Mount
Technology |
|
|
Technology |
|
Surface Mount
Technology Pin Through Hole |
|
Chip-on-BoardMixed
Module Technology |
| Flip
Chip | |
| Equipment |
|
| Surface Mount
Assembly: |
Chip-on-Board
Assembly |
|
Pic & Place - Siemens Siplace 80 S25
Mydata TP9 - UFP, Quad APS-1, Yamaha YV1001
Reflow Ovens - Heller, BTU, Omniflo, Infraflo
Screen Printing - MPM: AP25, UP2000
Aqueous cleaner - Corpane
Lonograph - Alpha Metal SMD II |
- Die Attach - ASM AD809
- Wire Bond - Delvotec 6400 (Fine Wire),
Plasma Cleaner
- Gloptop/Encapsulation - Camalot,
Minarik
|
Packaging and Test Turnkey
Services (Discrete)
- Wafer Backgrinding
- Wafer Probing
- Assembly/Packaging
- Final Test
- Product Engineering
- Failure Analysis
- Product Reliability
- Component/Logistics
Outsourcing
- Drop Shipment
RF & Microwave Turnkey
Services
- Surface Mount Assembly
- Mix Assembly
- Functional Test
- RF and Microwave Test and Tuning
- Drop Shipment
- Prototyping Quick Turn
- Complete Product Assembly
- Direct Material Sourcing
- Build to Print Assembly
- Hybrid/ SMT Sub-assemblies
- Parametric and Harmonics Test
- Complete Box Build
- Board Repair Services
- RF Plug in / ODU
|
